MY101308A - Presensitized circuit material. - Google Patents
Presensitized circuit material.Info
- Publication number
- MY101308A MY101308A MYPI87000671A MYPI19870671A MY101308A MY 101308 A MY101308 A MY 101308A MY PI87000671 A MYPI87000671 A MY PI87000671A MY PI19870671 A MYPI19870671 A MY PI19870671A MY 101308 A MY101308 A MY 101308A
- Authority
- MY
- Malaysia
- Prior art keywords
- adhesion layer
- presensitized
- overlying
- circuit material
- photoresist
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 abstract 4
- 239000000654 additive Substances 0.000 abstract 2
- 230000000996 additive effect Effects 0.000 abstract 2
- 238000009713 electroplating Methods 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910000599 Cr alloy Inorganic materials 0.000 abstract 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 239000011651 chromium Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000003912 environmental pollution Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000003384 imaging method Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 239000002699 waste material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87184386A | 1986-06-09 | 1986-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY101308A true MY101308A (en) | 1991-09-05 |
Family
ID=25358267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI87000671A MY101308A (en) | 1986-06-09 | 1987-05-16 | Presensitized circuit material. |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0257737A3 (en]) |
| JP (1) | JPS62293689A (en]) |
| KR (1) | KR960001355B1 (en]) |
| CA (1) | CA1263763A (en]) |
| MY (1) | MY101308A (en]) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1286586C (en) * | 1987-03-26 | 1991-07-23 | Shigeki Yokoyama | Finish laminates for high frequency circuits |
| DE3907004A1 (de) * | 1989-03-04 | 1990-09-06 | Contraves Ag | Verfahren zum herstellen von duennschichtschaltungen |
| JP2795702B2 (ja) * | 1989-10-26 | 1998-09-10 | イビデン株式会社 | 高密度配線板の製造方法 |
| JPH05129760A (ja) * | 1991-11-06 | 1993-05-25 | Fujitsu Ltd | 導体パターンの形成方法 |
| JPH08330728A (ja) * | 1995-05-26 | 1996-12-13 | Toyo Metaraijingu Kk | フレキシブルプリント配線用基板 |
| MY139405A (en) * | 1998-09-28 | 2009-09-30 | Ibiden Co Ltd | Printed circuit board and method for its production |
| CA2327801A1 (en) * | 2000-03-21 | 2001-09-21 | Rocky L. Hilburn | Copper on polymer component having improved adhesion |
| WO2002003767A1 (en) * | 2000-06-29 | 2002-01-10 | 3M Innovative Properties Company | Multi-metal layer circuit |
| KR100912920B1 (ko) | 2001-09-05 | 2009-08-20 | 니폰 제온 가부시키가이샤 | 다층 회로 기판, 수지 기재 및 그의 제조 방법 |
| KR100464559B1 (ko) * | 2002-03-22 | 2005-01-03 | 정남교 | 벨크로 테이프 제조장치 |
| JP4298597B2 (ja) | 2004-07-01 | 2009-07-22 | 日東電工株式会社 | 配線回路基板および配線回路基板の製造方法 |
| SG126776A1 (en) * | 2005-04-08 | 2006-11-29 | 3M Innovative Properties Co | Flexible circuit substrate |
| US9953908B2 (en) | 2015-10-30 | 2018-04-24 | International Business Machines Corporation | Method for forming solder bumps using sacrificial layer |
| JP2021056162A (ja) * | 2019-10-01 | 2021-04-08 | 日東電工株式会社 | 導電フィルムおよび温度センサフィルム |
| CN110676156A (zh) * | 2019-10-21 | 2020-01-10 | 昆山百利合电子材料有限公司 | 一种光刻半导体加工工艺 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3832176A (en) * | 1973-04-06 | 1974-08-27 | Eastman Kodak Co | Novel photoresist article and process for its use |
| US3981691A (en) * | 1974-07-01 | 1976-09-21 | Minnesota Mining And Manufacturing Company | Metal-clad dielectric sheeting having an improved bond between the metal and dielectric layers |
-
1987
- 1987-05-16 MY MYPI87000671A patent/MY101308A/en unknown
- 1987-05-25 CA CA000537885A patent/CA1263763A/en not_active Expired
- 1987-06-08 JP JP62143034A patent/JPS62293689A/ja active Granted
- 1987-06-08 KR KR1019870005760A patent/KR960001355B1/ko not_active Expired - Lifetime
- 1987-06-08 EP EP87305039A patent/EP0257737A3/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0257737A2 (en) | 1988-03-02 |
| KR880001182A (ko) | 1988-03-31 |
| JPS62293689A (ja) | 1987-12-21 |
| CA1263763A (en) | 1989-12-05 |
| JPH0465558B2 (en]) | 1992-10-20 |
| EP0257737A3 (en) | 1989-07-19 |
| KR960001355B1 (ko) | 1996-01-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY101308A (en) | Presensitized circuit material. | |
| US4705592A (en) | Process for producing printed circuits | |
| MY108905A (en) | Copper-clad laminate and printed wiring board | |
| EP0152634A2 (en) | Method for manufacture of printed wiring board | |
| ES8607673A1 (es) | Procedimiento para fabricar placas conductoras flexibles con contactos de paso para elevados esfuerzos por flexion | |
| EP0258451A4 (en) | PRODUCTION OF PANELS WITH ELECTRICAL CIRCUITS. | |
| MY125599A (en) | Printed circuit boards and method of producing the same | |
| EP1968368A3 (en) | Printed wiring board and method for producing the same | |
| ATE180920T1 (de) | Methode zur herstellung eines verbundstoffes mit einer metallschicht auf einer leitfähigen polymerschicht | |
| KR840001047A (ko) | 복합 금속 박편을 이용한 인쇄 회로판 제조용 제품 및 그 제조방법 | |
| EP1194024A4 (en) | MULTILAYER PRINTED PCB AND ITS MANUFACTURING METHOD | |
| EP0641152A1 (en) | Process for forming a circuit with a laser and component formed thereby | |
| DE3586422D1 (de) | Elektrisch leitende kupferschichten und verfahren zur herstellung derselben. | |
| AU2896995A (en) | Copper foil for the manufacture of printed circuits and method of producing same | |
| JPH069308B2 (ja) | フレキシブルプリント配線用基板 | |
| JPS6453592A (en) | Conductive substrate for transfer of conductor circuit | |
| JPH05218598A (ja) | プリント配線板 | |
| Roberts | Ultrathin Copper Foil and Process for Producing Such Foil | |
| Yamamoto | Electrically Conductive Member for Plating and Electrolyzing | |
| JPS647690A (en) | Manufacture of through-hole printed circuit board | |
| Thompson | Polyethersulphone—A Thermoplastic PCB Substrate | |
| JPS6480097A (en) | Manufacture of printed wiring board | |
| Arrowsmith | The Multilayer Printed Circuit Board Handbook Edited by: JA Scarlett Publisher: Electrochemical Publications Cost:£ 59.00 plus handling | |
| Arrowsmith | An Introduction to Printed Circuit Board Technology Edited by: JA Scarlett Publisher: Electrochemical Publications Cost:£ 24.00 plus handling | |
| GB795822A (en) | Improvements in or relating to the production of printed electric circuits |